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Introducing Liquid PlasmaTM Technology.
The next stage of evolution in megasonics critical cleaning systems.
Liquid Plasma™ is a patent-pending technology that
uses multi-vectored processing components to evenly transfer megasonics
energy directly through solid structures of various shapes and thickness to
the substrate or fluid interface for optimal effect.
Designed to:
- Improve yields
- Reduce processing time
- Remove smaller particles than traditional megasonics.
- Work with fragile device structures
- Eliminate shadowing
- Eliminate unwanted bubbles
- Reduce energy intensive cavitations
- Work with multiple simultaneous frequencies up to 5 MHz
- Produce the most uniform energy distribution available
- Enhance cross substrate energy transfer
- Eliminate standing waves
- Run cooler than traditional megasonics
Liquid PlasmaTM
Velvet touch soft sonictm processing finger
The Velvet Touch Soft Sonic™ Processing Finger has
integrated PCT’s revolutionary Liquid Plasma™ Technology directly into the
finger enabling uniform energy distribution across both substrate and finger
even with numerous fluid jet holes in the finger’s active surface. The
energy coverage is uniform even with the
finger mounted face up under the substrate plus, the Liquid Plasma™
Technology facilitates good cross-substrate energy transfer and uniform
energy distribution.
Features
- Entire substrate can be energized without rotation
- Processing liquid delivered directly through finger
- Variable flow rates and pressures
- Horizontal or vertical orientation of substrate or finger
- Multiple fluid jets can handle liquid or gas
- Higher gas concentrations than possible on
- conventional systems
- Expandable to any length or width
- Variable power density from 25 watts/sq in to less than
- 0.10 watts/sq in for demanding or gentle processing
Liquid PlasmaTM applications
In addition to wafer cleaning, Liquid Plasma™ Technology enables you to experience significant benefits in many new application areas:
Mems
- Etches faster
- More thorough cleaning into tortuous paths
- Removes bubbles which slow mass transfer from substrate surface
CMP
- Remove particles faster
- More uniform processing
- Better planarity
- No dishing
- No fish-tailing
- No nose-diving
Electro plating
- Eliminates concentration polarization
- Etches faster
- Eliminates chemicals
Plus many more
Contact PCT and find out what Liquid Plasma™ Technology can do for
you...
